Transistor with controllable compensation regions

ABSTRACT

Disclosed is a MOSFET including at least one transistor cell. The at least one transistor cell includes a source region, a drain region, a body region and a drift region. The body region is arranged between the source region and the drift region and the drift region is arranged between the body region and the drain region. The at least one transistor cell further includes a compensation region arranged in the drift region and distant to the body region, a source electrode electrically contacting the source region and the body region, a gate electrode arranged adjacent the body region and dielectrically insulated from the body region by a gate dielectric, and a coupling arrangement including a control terminal. The coupling arrangement is configured to electrically couple the compensation region to at least one of the body region, the source region, the source electrode and the gate electrode dependent on a control signal received at the control terminal.

TECHNICAL FIELD

Embodiments of the present application relate to a transistor, in particular a MOS transistor with a compensation region.

BACKGROUND

MOSFETs (Metal Oxide Semiconductor Field-Effect Transistors), in particular power MOSFETs, are widely used as electronic switches for switching electrical loads or as electronic switches in all types of switching converters. A power MOSFET includes a drain region, a drift region adjoining the drain region, and a source region, each having a first conductivity type, and a body region arranged between the drift region and source region of a second conductivity type. A gate electrode serves to control a conducting channel in the body region between the source region and the drift region. The source electrode is electrically connected to a source electrode which is also connected to the body region, and the drain region is electrically connected to the drain electrode. The MOSFET can be switched on and off by applying a suitable drive potential to the gate terminal.

In a specific type of MOSFET, which is also referred to as compensation or superjunction MOSFET, a compensation region is arranged in the drift region. This compensation region is of the same doping type as the body region and is electrically connected to the body region. The compensation region includes doping charges that are complementary to the doping charges in the drift region and that “compensate” the doping charges in the drift region when the MOSFET is in its off-state. By virtue of the compensation regions the drift region can be more highly doped than in conventional MOSFETs, resulting in a reduced on-resistance, at a given voltage blocking capability.

MOSFETs include a voltage dependent output capacitance (usually referred to as C_(OSS)) which usually includes a drain-source capacitance C_(DS) between its drain and source terminals and a gate-drain capacitance C_(GD) between its gate and drain terminals. When the MOSFET transitions from the on-state to the off-state, the output capacitance is charged, i.e. energy is stored in the output capacitance; the output capacitance is discharged, when the MOSFET transitions from the off-state to the on-state. The output energy E_(OSS), which is the energy stored in the output capacitance, is mainly dependent on the voltage across the drain-source path when the MOSFET is in its off-state and is dependent on the capacitance value of the output capacitance. A compensation MOSFET, due to the compensation regions connected to the body regions and the source electrode, has a high drain-source capacitance and, therefore, has a high output capacitance.

Losses occur when a MOSFET is operated. These losses mainly include capacitive losses and ohmic losses.

Capacitive losses are defined by the energy stored in the output capacitance of the MOSFET, wherein these losses increase with increasing output capacitance. In many applications, the capacitive losses dominate the switching losses under typical load conditions.

Ohmic losses occur when the MOSFET is in its on-state. Ohmic losses are due to the MOSFET's on-resistance. Additionally, switching losses occur when the MOSFET switches from the on-state to the off-state, and vice versa. These switching losses result from the fact that MOSFETs do not switch on or off abruptly, but they gradually change between the on-state, in which an ohmic resistance of the MOSFET assumes its minimum value, and the off-state, in which the MOSFET blocks and prevents a current flow. The minimum value of the ohmic resistance is the on-resistance.

The ohmic losses are proportional to the square of the load current, while the capacitive losses have a smaller dependency on the load current. Therefore, dependent on the specific load conditions, the ohmic losses or the capacitive losses may prevail. For example, when a load connected to the MOSFET draws a low load current, so that a low current flows through the MOSFET in its on-state, the capacitive losses may mainly determine the overall losses. Whereas, when the load draws a high load current, the ohmic losses and switching losses during transition phases may mainly determine the overall losses. The switching losses during transition phases and the capacitive losses are directly proportional to the switching frequency of the device.

In addition, the output charge Q_(OSS), which is the charge stored in the output capacitance, is important for some applications. E.g., the turn off delay time of the MOSFET at low load currents is dominated by the output charge. This is the charge which has to be stored in the output capacitance before the transistor is completely turned off. This output charge is provided by the load current. Therefore, the turn off delay time increases inversely proportional with decreasing load current.

There is, therefore, a need to provide a MOSFET with a compensation region in which dependent on the load conditions the losses and turn off delay time can be minimized.

SUMMARY

A first aspect relates to a MOSFET including at least one transistor cell. The transistor cell includes a source region, a drain region, a body region and a drift region. The body region is arranged between the source region and the drift region and the drift region is arranged between the body region and the drain region. The transistor cell further includes a compensation region arranged in the drift region and distant to the body region, a source electrode electrically contacting the source region and the body region, and a gate electrode arranged adjacent the body region and dielectrically insulated from the body region by a gate dielectric. A coupling arrangement includes a control terminal and is configured to electrically couple the compensation region to at least one of the body region, the source region, the source electrode and the gate electrode dependent on a control signal received at the control terminal.

A second aspect relates to a MOSFET including at least one transistor cell of a first type and at least one transistor cell of a second type. The at least one transistor cell of the first type includes a first source region, a first drain region, a first body region and a first drift region. The first body region is arranged between the first source region and the first drift region and the first drift region is arranged between the first body region and the first drain region. The at least one transistor cell of the first type further includes a first gate electrode arranged adjacent the first body region and dielectrically insulated from the first body region by a first gate dielectric, a first source electrode electrically contacting the first source region and the first body region, and a first compensation region arranged in the first drift region and electrically connected to at least one of the first body region, the first source region and the first gate electrode.

The at least one transistor cell of the second type includes a second drain region, a second body region and a second drift region, the second drift region arranged between the second body region and the second drain region, a second compensation region arranged in the second drift region and distant to the second body region, and a second source electrode electrically contacting the second body region. The at least one transistor cell of the second type further includes a coupling arrangement including a control terminal and being configured to electrically couple the second compensation region to at least one of the second body region and the second source electrode dependent on a control signal received at the control terminal.

Those skilled in the art will recognize additional features and advantages upon reading the following detailed description, and upon viewing the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

Examples will now be explained with reference to the drawings. The drawings serve to illustrate the basic principle, so that only aspects necessary for understanding the basic principle are illustrated. The drawings are not to scale. In the drawings the same reference characters denote like features.

FIG. 1 schematically illustrates the use of a MOSFET as an electronic switch for switching a load;

FIG. 2 schematically illustrates the voltage-dependency of an output capacitance of a MOSFET;

FIG. 3 schematically illustrates a vertical cross sectional view of a MOSFET including a coupling arrangement connected between a compensation region and a source electrode;

FIG. 4 schematically illustrates a vertical cross sectional view of a MOSFET including a plurality of transistor cells;

FIG. 5 schematically illustrates a horizontal cross sectional view of a MOSFET implemented with stripe transistor cells;

FIG. 6 schematically illustrates a horizontal cross sectional view of a MOSFET implemented with rectangular transistor cells;

FIG. 7 schematically illustrates a horizontal cross sectional view of a MOSFET implemented with hexagonal or polygonal transistor cells;

FIG. 8 schematically illustrates a vertical cross sectional view of a MOSFET including a coupling arrangement with a control electrode;

FIG. 9 illustrates a horizontal cross sectional view of the MOSFET according to FIG. 8 when implemented with stripe transistor cells;

FIG. 10 illustrates a horizontal cross sectional view of the MOSFET according to FIG. 8 when implemented with rectangular transistor cells;

FIG. 11 illustrates a horizontal cross sectional view of the MOSFET according to FIG. 8 when implemented with hexagonal transistor cells;

FIG. 12 illustrates a horizontal cross sectional view of the MOSFET according to FIG. 8 when implemented with rectangular transistor cells and a stripe-shaped control electrode;

FIG. 13 illustrates a horizontal cross sectional view of the MOSFET according to FIG. 8 when implemented with stripe transistor cells and rectangular control electrodes;

FIG. 14 schematically illustrates a perspective sectional view of a transistor cell of a MOSFET including a coupling arrangement with a control electrode, a connection electrode and a contact electrode;

FIG. 15 schematically illustrates a vertical cross sectional view of the transistor cell of FIG. 14 in a section plane C-C;

FIG. 16 schematically illustrates a perspective sectional view of a transistor cell of a MOSFET according to a further embodiment;

FIG. 17 schematically illustrates a perspective sectional view of a conventional transistor cell;

FIG. 18 schematically illustrates a first embodiment of arranging transistor cells with a coupling arrangement and conventional transistor cells in a semiconductor body;

FIG. 19 schematically illustrates a second embodiment of arranging transistor cells with a coupling arrangement and conventional transistor cells in a semiconductor body;

FIG. 20 schematically illustrates a vertical cross sectional view of transistor cells that include a compensation region and a coupling arrangement that do not include a channel region;

FIG. 21 shows the circuit diagram of a MOSFET including transistor cells with a coupling arrangement in conventional transistor cells according to a first embodiment;

FIG. 22 shows the circuit diagram of a MOSFET including transistor cells with a coupling arrangement in conventional transistor cells according to a second embodiment.

FIG. 23 schematically illustrates a vertical cross sectional view of a MOSFET including a coupling arrangement according to a further embodiment connected between a compensation region and a source electrode.

DETAILED DESCRIPTION

In order to ease a better understanding of embodiments which will be explained herein further below, the use of a transistor component as an electronic switch will be explained with reference to FIG. 1. FIG. 1 shows a circuit diagram with a transistor component 1 that acts as an electronic switch for switching a current through a load Z. The transistor component 1, which in the example of FIG. 1 is implemented as a MOSFET, includes a gate terminal G which is configured to receive a drive signal S1 from a drive circuit 2, and a load path. The load path, which can also be referred to as internal load path, extends within the transistor 1 between a drain and a source terminal D, S. The load path D-S is connected in series with a load Z, with the series circuit with the transistor 1 and the load Z being connected between terminals for a first and a second supply potential V+, GND. The load Z can be a resistive load such as e.g. a filament bulb, an inductive load such as a coil, a transformer or an induction motor, or a capacitive load.

The transistor 1 can be switched on and off by the drive circuit 2 that generates a suitable drive signal S1 at the gate terminal G of the transistor 1. The drive signal is, for example, a pulsewidth-modulated (PWM) signal. This is commonly known, so that no further explanation is required in this regard.

When the MOSFET is switched on, i.e. when the MOSFET is in its on-state, a load current I_(D) flows through the load Z and the load path of the transistor 1, where the magnitude of the load current I_(D) is mainly defined by the supply voltage present between the terminals for the first and second supply potential V+, GND and by the characteristic of the load Z. When the transistor 1 is in its on-state, ohmic losses occur in the transistor 1. These losses result from the on-resistance of the transistor 1 and the load current I_(D) flowing through the transistor 1. When the MOSFET changes its operation state from the on-state to the off-state, i.e. when the MOSFET is switched off, or vice versa, losses increase for a short time interval. This is due to the simultaneous presence of high currents and high voltages at the load terminals D, S of the transistor 1 in transition phases between the on-state and the off-state.

Transistor components, in particular MOSFETs, include an output capacitance which is effective between the drain and the source and the drain and the gate terminals and usually includes a drain-source capacitance C_(DS) between the drain and the source terminals D, S and a gate-drain C_(GD) capacitance between the gate and the drain terminal. In FIG. 1 the drain-source capacitance C_(DS) is schematically illustrated. It should be noted in this connection that the drain-source capacitance and the drain-gate capacitance can be regarded to be connected in parallel in a small-signal equivalent circuit diagram. A capacitance value C_(OSS) of the output capacitance is dependent on the voltage between the drain and source terminals D, S of the transistor 1. The dependency of this capacitance value C_(OSS) on the voltage V_(DS) between the drain and source terminals D, S is schematically illustrated in FIG. 2.

When the transistor 1 is switched off and the voltage V_(DS) across the load path of the transistor 1 increases, the output capacitance is charged, i.e. energy is stored in the output capacitance. Equivalently, the output capacitance is discharged when the MOSFET is switched on. Charging the output capacitance when the MOSFET is switched off, and discharging the output capacitance when the MOSFET is switched on causes losses, which will be referred to as capacitive losses in the following.

Losses that occur when the transistor component 1 is operated in a switched-mode, i.e. when the transistor component 1 is cyclically switched on and off, include ohmic losses, switching losses during transition phases, and capacitive losses. Which of these losses prevails is dependent on the load condition of the transistor component 1. The load condition of the transistor component 1 is mainly defined by the load current I_(D) flowing through the transistor 1 in its on-state, but is also defined by the switching frequency at which the transistor is switched on and off.

The capacitive losses are dependent on the energy which is stored in the output capacitance when the transistor 1 is switched off. This energy is dependent on the capacitance value C_(OSS) of the output capacitance and the maximum voltage across the load path of the transistor 1 when the transistor 1 is in its off-state.

There are transistor components in which the capacitance value C_(OSS) of the output capacitance is dependent on the voltage across the load path of the transistor 1. FIG. 2 schematically illustrates such voltage-dependency of the output capacitance value C_(OSS) on the voltage across the transistor. In FIG. 2, C_(OSS) denotes the output capacitance value, and V_(DS) denotes the voltage between the drain and source terminals D, S of the transistor 1. As can be seen from FIG. 2, there is a voltage V_(DS0) at which the output capacitance value C_(OSS) significantly decreases when the voltage V_(DS) increases.

In FIG. 2, besides the curve in which the output capacitance value C_(OSS) rapidly decreases at V_(DS0), two further curves are shown in which the capacitance value rapidly decreases at a voltage higher than V_(DS0) and rapidly decreases at a voltage lower than V_(DS0), respectively. The V_(DS0) voltage can be dependent on the maximum capacitance value, which occurs at low drain-source voltages V_(DS). According to one embodiment, the V_(DS0) voltage decreases with decreasing maximum capacitance value C_(OSS).

The energy E_(OSS) stored in the output capacitance is given by:

$\begin{matrix} {E_{OSS} = {\int_{DSon}^{V_{DSoff}}{{C_{OSS}\left( V_{DS} \right)}V_{DS}\ {\mathbb{d}V_{DS}}}}} & {1.\mspace{14mu}\left( {1a} \right)} \end{matrix}$ where V_(DSon) is the voltage across the load path when the transistor 1 is in its on-state, and V_(DSoff) is the voltage across the load path when the transistor 1 is in its off-state. C_(OSS)(V_(DS)) is the output capacitance value which is dependent on the voltage V_(DS). Since the voltage V_(DSon) across the transistor 1 in its on-state is, usually, very low and significantly lower than the voltage V_(DSoff) in the off-state, equation (1a) can be simplified to

$\begin{matrix} {{E_{OSS} = {\int_{0}^{V_{DSoff}}{{C_{OSS}\left( V_{DS} \right)}V_{DS}\ {\mathbb{d}V_{DS}}}}},} & \left( {1b} \right) \end{matrix}$

It can be seen from FIG. 2 and from equations (1 a) or (1 b), respectively, that the energy E_(OSS) stored in the output capacitance and, therefore, the capacitive losses can be reduced by decreasing the voltage value V_(DS0) at which the output capacitance value C_(OSS) decreases as well as by reducing the plateau-value, i.e. the maximum capacitance value, at low V_(DS).

A first embodiment of a transistor component 10 which has a voltage-dependent output capacitance and in which the voltage-dependency of the output capacitance can be adjusted is explained next with reference to FIG. 3.

The transistor component 10 illustrated in FIG. 3 is implemented as a MOSFET, specifically as a compensation or superjunction MOSFET. The characteristic curve of the output capacitance C_(OSS) illustrated in FIG. 2 in which there is a strong dependency of the output capacitance C_(OSS) on the drain-source voltage V_(DS) is typical for a superjunction MOSFET. The MOSFET includes a source region 12 connected to a source electrode 51 forming a source terminal S, and a drain region 14 connected to a drain terminal D. The drain terminal may be formed by a drain electrode 52 arranged on the drain region 14. The MOSFET further includes a drift region 11 and a body region 13, where the body region 13 is arranged between the source region 12 and the drift region 11, and the drift region 11 is arranged between the body region 13 and the drain region 14. The source region 12, the body region 13, the drift region 11 and the drain region 14 are integrated in a semiconductor body 100. The MOSFET according to FIG. 3 is implemented as a vertical MOSFET, which is a MOSFET in which the source region 12 and the drain region 14 are arranged distant to one another in a vertical direction of the semiconductor body 10. In this case, a current essentially flows in a vertical direction through the semiconductor body 100 when the MOSFET is in its on-state. However, implementing the MOSFET as a vertical MOSFET is only an example. The basic principle explained herein below is also applicable to lateral MOSFETs in which the source and the drain regions are arranged distant to one another in a lateral direction of a semiconductor body. The basic principle is also applicable to MOSFETs (not shown) in which the drain region is implemented as a buried layer that is arranged distant to the source region in a vertical direction of the semiconductor body. The buried layer can be connected to a drain terminal that is arranged on or above the same surface of the semiconductor body as the source terminal.

The source region 12 and the body region 13 are both connected to the source electrode 51 that forms the source terminal S. This is common practice in MOSFETs.

The MOSFET further includes a gate electrode 21 connected to or forming a gate terminal G. The gate electrode 21 is arranged adjacent to the body region 13, wherein a gate dielectric 22 is arranged between the gate electrode 21 and the body region 13. In a commonly known manner the gate electrode 21 serves to control a first conducting channel in the body region 13 between the source region 12 and the drift region 11. In the embodiment illustrated in FIG. 3, the gate electrode 21 is a planar electrode, i.e. the gate electrode 21 is arranged above one of the surfaces of the semiconductor body 100. However, this is only an example. The gate electrode 21 could also be implemented as a trench electrode (not shown) in a trench of the semiconductor body 100.

The MOSFET is in its on-state, when an electrical potential applied to the gate terminal G is suitable to generate a first conducting channel along the gate dielectric 22 in the body region 13, and the MOSFET is in its off-state, when there is no suitable drive potential at the gate terminal G to generate a conducting channel in the body region 13.

The MOSFET may be implemented as an enhancement MOSFET. In this case, the body region 13 is doped complementarily to the source region 12, so that the first conducting channel generated in the body region 13 and controlled by the gate electrode 21 is an inversion channel. However, the MOSFET could also be implemented as a depletion MOSFET. Further, the MOSFET may be implemented as an n-type MOSFET or as a p-type MOSFET. In an n-type MOSFET the source region 12 and the drain region 14 are n-doped, while in a p-type MOSFET the source region 12 and the drain region 14 are p-doped.

The MOSFET of FIG. 3 is implemented as a compensation or superjunction MOSFET and includes a compensation region 31 in the drift region 11. The compensation region 31 has a doping type that is complementary to the doping type of the drift region, so that a pn-junction is formed between the compensation region 31 and the drift region 11.

The compensation region 31, which has the same doping type as the body region 13, is separated from the body region 12. In the embodiment illustrated in FIG. 3, the compensation region 31 is arranged below the body region 13 and is arranged distant to the body region 13 in the vertical direction of the semiconductor body 100, so that a section 11′ of the drift region 11 is arranged between the body region 13 and the compensation region 31. This allows the compensation region 31 to assume an electrical potential that is different from the electrical potential of the body region 13.

The MOSFET further includes a coupling arrangement 40 that is configured to electrically couple the compensation region 31 to at least one of the body region 13, the source region 12, and the source electrode 51 dependent on a control signal received at a control terminal G2. The coupling arrangement 40 is only schematically illustrated as a switch. This switch may be implemented as an electronic switch, such as a transistor, connected between the compensation region 31 and the source electrode 51. The compensation region 31 may include a contact electrode (not shown) at which the switch is connected to the compensation region 31. In the embodiment illustrated in FIG. 3, the compensation region 31 is implemented as a buried region that is below the body region 13 and distant to a surface of the semiconductor body 100 in a vertical direction. However, the compensation region 31 may include a section that extends to the surface (in a vertical plane other than the one illustrated in FIG. 3) where the compensation region 31 can be contacted. Other embodiments for implementing the coupling arrangement are explained below.

According to a further embodiment (not shown), the coupling arrangement 40 may be connected between the compensation region 31 and the gate electrode 21 instead of the body region 13, the source region 12, or the source electrode 51.

The coupling arrangement 40 may assume two different operating states. In a first operating state, the coupling arrangement 40 couples the compensation zone 31 to at least one of the body region 13, the source region 12, and the source electrode 51. In a second operating state, the coupling arrangement 40 decouples (separates) the compensation zone 31 and the body region 13/source electrode 51, so that the compensation region 31 is floating. The coupling arrangement 40 includes a control terminal G2 through which the operating state of the coupling arrangement 40 can be controlled. The operating state of the coupling arrangement 40 is independent on whether the MOSFET is in its on-state or off-state. Thus, the MOSFET may include two different switching states, namely an on-state and an off-state, and two different operating states, namely a first operating state when the coupling arrangement 40 is in the first operating state, and a second operating state when the coupling arrangement 40 is in the second operating state.

The operating principle of the MOSFET according to FIG. 3 is now explained. For explanation purposes it is assumed that the MOSFET is an n-type enhancement MOSFET. However, the explanation provided herein below also applies to a p-type MOSFET and to a depletion MOSFET.

Like a conventional MOSFET, the MOSFET can be switched on and off by applying a suitable drive potential at the gate terminal G. When the MOSFET is switched on (is in its on-state) there is a conducting channel in the body region 13 between the source region 12 and the drift region 11 along the gate dielectric 22. When the MOSFET is switched off, the conducting channel along the gate dielectric 22 is interrupted. When the MOSFET is in the off-state and when a voltage is applied between the drain and source terminals D, S (a positive voltage in an n-type MOSFET and a negative voltage in a p-type MOSFET), a depletion zone expands in the drift region 11. This depletion zone, or the electric field associated with the depletion zone, also causes the compensation region 31 to be depleted of charge carriers. Thus, dopants (the doping charge) in the drift region 11 are “compensated” by complementary dopants in the compensation region 31. This mechanism occurs independent of whether the coupling arrangement 40 is in the first or second operation mode, i.e. independent of whether or not the compensation region 31 is coupled to the body region 13/source electrode 51.

The compensation effect explained above allows to provide a higher doping concentration in the drift region 11, resulting in a lower on-resistance, as compared with conventional (non-superjunction) components, without decreasing the voltage blocking capability. This basic operating principle of a superjunction device is commonly known so that no further explanation is required in this regard.

When the MOSFET is in its off-state, the compensation region 31 and the drift region 11 include electrical charges. These charges are positive charges (in the form of positively charged donor centers) in a n-doped drift region and negative charges (in the form of negatively charged acceptor centers) in a p-doped compensation region and cause a depletion region to extend in the drift region 11 and the compensation region 31. When the MOSFET is driven to switch from the off-state to the on-state, two different scenarios may occur dependent on whether the coupling arrangement 40 is in the first operation mode or in the second operation mode.

-   -   (a) When the coupling arrangement 40 is in the first operation         mode, so that the compensation region 31 is electrically coupled         to the source electrode 51, the drift region 11 and the         compensation region 31 are “discharged” so that the depletion         region between the compensation region 31 and the drift region         11 is removed. This corresponds to the operation of a         conventional superjunction device.     -   (b) When the coupling arrangement 40 is in the second operation         mode, so that the compensation region 31 is not electrically         coupled to the source electrode 51 (is floating), the         compensation region 31 cannot be discharged completely so that         the depletion region between the compensation region 31 and the         drift region 11 cannot totally be removed. This may cause a         conducting channel in the drift region 11 between the drain         region 14 and the “channel region” to be partially or completely         be pinched off, even when the MOSFET is in its on-state. The         channel region is that region of the body region 13 in which a         conducting channel along the gate dielectric 22 can be         controlled.

The MOSFET according to FIG. 3 has an output capacitance with an output capacitance value C_(OSS) that has a characteristic according to FIG. 2 and which significantly decreases when the voltage reaches a threshold value V_(DS0). The characteristic illustrated in FIG. 2 in which the output capacitance value C_(OSS) has a high value for voltages below the threshold value V_(DS0), and has a lower value for voltages above the threshold value V_(DS0) is equivalent to the fact that at voltages lower than the threshold value V_(DS0) a higher charge has to be provided to the load path of the transistor 10 to increase the voltage across the load path for a given voltage value □V_(DS) than at higher voltages, i.e. voltages higher than the threshold voltage V_(DS0). The capacitance value at lower voltages can be up to 10 times to 100 times higher than the capacitance value at higher voltages. Thus, at lower voltages a charge for increasing the voltage for □V_(DS) is 10 times to 100 times higher than the charge required at higher voltages. MOSFETs of the type illustrated in FIG. 3 can be designed to have a breakdown voltage of between 50V and 2000V (2 kV). The voltage V_(DS0) at which the output capacitance decreases is, for example, between 5V and 80 V, in particular between 10V and 80V, for such MOSFETs.

The mechanism that causes the explained voltage-dependency of the output capacitance value in the MOSFET according to FIG. 3 will now be for scenario (a), when the coupling arrangement 40 is in the first operation state. When the MOSFET is in its off-state charge carriers are accumulated in the drift region 11 and the compensation region 31. In the on-state there is a junction capacitor with a huge capacitance between the compensation region 31 and the drift region 11. This capacitor significantly contributes to the drain-source capacitance C_(DS) and, thus, significantly contributes to the output capacitance C_(OSS) of the MOSFET. When the MOSFET is switched off, i.e. when the channel along the gate dielectric 22 is interrupted, this junction capacitance has to be charged (which is equivalent to removing dopant charges from the compensation region 31 and the drift region 11) before the voltage across the drift region 11 and, thus, the voltage between the drain and source terminals D, S, can significantly increase. When the compensation region 31 and the drift region 11 have been charged, a depletion region expands in the drift region 11 and the compensation region 31. At the time when the compensation region 31 has been completely charged, the junction capacitor “disappears” causing a rapid decrease of the output capacitance C_(OSS). The slope of the decrease of the output capacitance C_(OSS) is steep and occurs at the voltage V_(DS0) shown in FIG. 2. V_(DS0), which is, e.g., between 5V and 80V, is dependent on the geometry of the compensation region 31 and its doping concentration. V_(DS0) represents a specific value of the drain-source voltage V_(DS) at which the drift region 11 is completely depleted by a space charge region that expands in a direction perpendicular to a current flow direction of the MOSFET.

The doping concentration of the drift region 11 is, for example, in the range of between 10¹⁴ (1E14) cm⁻³ and 10¹⁶ (1E16) cm⁻³. The doping concentration of the compensation region 31 may be in the same range.

A superjunction device with compensation region 31 that, as in scenario (a), is charged when the MOSFET is switched off and is discharged when the MOSFET is switched on has a higher output capacitance C_(OSS), but a lower on-resistance, than a conventional MOSFET. The output capacitance C_(OSS) is reduced when the compensation, as in scenario (b), is not electrically coupled to the source electrode 51, i.e. when the compensation region 31 is floating. However, there is an increased on-resistance in this case. Thus, via the controllable coupling arrangement 40 the output capacitance and the on-resistance of the MOSFET can be varied. There is a tradeoff in that a decrease of the output capacitance, resulting in decreased of capacitive losses, is associated with an increase of the on-resistance, resulting in higher ohmic losses. A decrease of the on-resistance, resulting in decreased ohmic losses, is associated with an increase of the output capacitance, resulting in higher capacitive losses.

The operating principle which has been explained for an n-type MOSFET hereinbefore also applies to a p-type MOSFET, wherein in a p-type MOSFET the individual semiconductor regions have a complementary doping type, and the voltages have a reversed polarity.

The compensation region 31 and the drift region 11 form a JFET (junction FET) between the body region 13 and the drain region 14. A circuit symbol of this JFET is illustrated in FIG. 3. When the MOSFET is in the off-state there are two depletion regions that expand in the drift region 11, a first depletion region expanding from the pn junction between the body region 13 and the drift region 11, and a second depletion region expanding from the pn junction between the compensation region 31 and the drift region 11.

The MOSFET according to FIG. 3 can be implemented with a plurality of identical structures, which are commonly known as transistors cells. In FIG. 3 only one transistor cell is illustrated. FIG. 4 illustrates a schematic cross sectional view of a MOSFET with a plurality of transistor cells. These transistor cells are connected in parallel by having the source regions 12 of the individual cells connected to a common source electrode 51, by having the gate electrodes 21 of the individual cells connected to a common gate terminal G, and by having the drain and drift regions 14, 11 of the individual cells connected to a common drain terminal D. The drift region 11 and the drain region 14 are common to the individual transistor cells.

The coupling arrangement 40 is configured to couple the compensation regions 31 of the individual cells to at least one of the body region 13, the source region 12 and the source electrode 51 dependent on a control signal received at the control terminal. For this, the coupling arrangement 40 includes a plurality of coupling cells, wherein each coupling cell serves to couple the compensation region 31 of at least one transistor cell to at least one of the body region 13, the source region 12 and the source electrode 51 of the transistor cell. In FIG. 4, two coupling cells 40 ₁, 40 _(n) are shown where each coupling cell serves to connect one compensation region 31 to one body region 13, source region 12 or source electrode 51. In the embodiment illustrated in FIG. 4, one compensation region 31 and one body region 13 is common to two transistor cells. However, this is only an example. It is also possible to implement the transistor cells such that only one compensation region 31, only one body region 13 and only one coupling cell is assigned to one transistor cell.

The coupling arrangement 40 can be implemented such that all the coupling cells are operated in the same operating state, which is the first operating state or the second operating state. However, it is also possible to implement the coupling arrangement 40 such that the individual coupling cells can be operated in the first or second operating state independently, so that some transistor cells can be operated with floating compensation regions 31, while others can be operated with their compensation regions 31 connected to the source electrode 51.

The individual transistor cells can be implemented with a conventional transistor cell geometry. FIG. 5 illustrates a schematic horizontal cross sectional view of a MOSFET with longitudinal or stripe cells. In this case, the source and body regions 12, 13 of the individual cells have a stripe geometry.

Referring to FIGS. 6 and 7 it is also possible to implement the transistor cells with a rectangular or square geometry (see FIG. 6) or with a hexagonal (see FIG. 7) or any other polygonal geometry. In this case, the body regions 13, have a rectangular or square, a hexagonal or polygonal geometry.

FIGS. 5 to 7 illustrate horizontal cross sectional views of the MOSFET in a section plane A-A illustrated in FIG. 4. The compensation regions 31 are not illustrated in FIGS. 5 to 7. The geometry of the compensation regions 31 in the horizontal plane may correspond to the geometry of the body region 13. Thus, in a MOSFET with stripe cells the compensation regions 31 may have a stripe geometry, in a MOSFET with a rectangular or square geometry, the compensation regions 31 may have a rectangular or square geometry, and in a MOSFET with hexagonal or polygonal cells, the compensation regions 31 may have a hexagonal or polygonal geometry. In each of these cases, the compensation regions 31 may be arranged below the body region 13 in a vertical direction of the semiconductor body 100, as illustrated in FIG. 4.

However, it is also possible to implement the compensation regions 31 with a geometry that is different from the geometry of the body region 13. For example it is possible to implement the compensation regions 31 with a stripe geometry, while the transistor cells have a rectangular, square, hexagonal or polygonal geometry. Further, it is possible to arrange the compensation regions 31 so that the compensation regions 31 are not aligned with the body regions 13, i.e. the compensation regions 31 do not necessarily have to be arranged below the body regions 13.

FIG. 8 illustrates a schematic vertical cross sectional view of a MOSFET illustrating one embodiment of implementing the coupling arrangement 40. In this embodiment, the compensation region 31 is arranged below the body region 13 and distant to the body region 13 in the vertical direction of the semiconductor body 100. The coupling arrangement 40, from which only one coupling cell is illustrated in FIG. 8, includes a control electrode 41 that is dielectrically insulated from the semiconductor body 100 by a control electrode dielectric 42. The control electrode 41 extends from the body region 13 to or into the compensation region 31. The control electrode 41 extends through a section 11′ of the drift region 11 that separates the body region 13 from the compensation region 31. In this section 11′ of the drift region 11 a channel region 43 of the coupling arrangement is formed along the control electrode dielectric 42 between the body region 13 and the compensation region 31.

The control electrode 41 is electrically connected to the control electrode G2 in a manner which is not illustrated in detail in FIG. 8. The control electrode 41 can be implemented with a conventional electrode material, such as a metal or a highly doped polycrystalline semiconductor material, such as polysilicon. The control electrode dielectric 42 can be implemented with a conventional dielectric material, such as an oxide, a nitride, or a high-k-dielectric.

The control electrode 41 serves to control an inversion channel in the channel region 43 between the compensation region 31 and the body region 13. This channel is a channel for p-type charge carriers when the compensation region 31 and the body region 13 are p-doped, and is a conducting channel for n-type charge carriers when the compensation region 31 and the body region 13 are n-doped. The coupling arrangement 40 is in the first operating state, when the control electrode 41, by applying a suitable drive potential to the control terminal G2, is driven to generate the inversion channel in the channel region 43. In an n-type MOSFET, in which the source region 12 is n-doped and the body region 13 is p-doped, an inversion channel is generated in the channel region 43 between the body region 13 and the compensation region 31 when an electrical potential is applied to the control terminal G2 that is below the source potential, which is the electrical potential of the body region 13, the source region 12 and the source electrode 51, respectively. According to one embodiment, a voltage to be applied between the control terminal G2 and the source electrode 51 or the source terminal S in order to generate a conducting channel is in the range of between −0.1 V and −15V. In a p-type MOSFET, in which the source region 12 is p-doped and the body region 13 is n-doped, the electrical potential to be applied to the control terminal G2 is a positive potential relative to the source potential in order to generate a conducting channel in a channel region 43. A voltage, to be applied between the control terminal G2 and the source terminal S is, for example, in the range of between 0.1 V and 15V.

The coupling arrangement 40 is in the second operating state when the control electrode 41 is driven such that there is no conducting channel along the control electrode dielectric 42 between the body region 13 and the compensation region 31. In this case, the compensation region 31 is floating. The coupling arrangement 40 is in the second operating state when the absolute value of a voltage applied between the control terminal G2 and the source terminal S is below a threshold value. This threshold value is, for example, between 0.5 V and 2V.

The MOSFET according to FIGS. 3 to 8 can be used like a conventional MOSFET as an electronic switch for switching an electronic load, as it has been explained with reference to FIG. 1. However, the MOSFET according to FIGS. 3 to 8, besides the gate terminal G, has at least one control terminal through which the operating state can be varied in order to adjust the output capacitance and the on-resistance, respectively. The MOSFET acts like a conventional superjunction MOSFET when the coupling arrangement 40 is in the first operating state. In this case, the compensation region 31 is electrically coupled to the body region 13 through the conducting channel in the channel region 43 along the control electrode dielectric 42. Further, the MOSFET can be operated with a reduced output capacitance, but an increased on-resistance when the coupling arrangement 40 is operated in the second operating state, so that the conducting channel between the body region 13 and the compensation region 31 is interrupted and so that the compensation region 31 is floating. In this second operating state the MOSFET still acts like a conventional superjunction device, but one with another set of electrical data, in particular with another output capacitance and another on-resistance.

The geometry of the control electrode 41 and the control electrode dielectric 42 in the horizontal plane may correspond to the transistor cell geometry. This is explained next with reference to FIGS. 9 to 11 in which schematically horizontal cross sectional views of MOSFETs with different cell geometries are illustrated in horizontal section planes that correspond to horizontal section plane B-B illustrated in FIG. 8.

FIG. 9 illustrates a horizontal cross sectional view of a MOSFET having a stripe cell geometry, so that the body region 13 has a stripe geometry. Section plane B-B does not cut through the body region 13. However, for a better understanding the position and the geometry of the body region 13 is also illustrated in dashed lines in FIGS. 9 to 11.

Referring to FIG. 9, the compensation region 31, the control electrode 41 and the control electrode dielectric 42 also have a stripe geometry. In the embodiment illustrated in FIG. 9 a width of the compensation region 31 is smaller than a width of the body region 13. The “width” in this connection is the dimension of the compensation region 31 and the body region 13 in a direction perpendicular to a longitudinal direction of the compensation region 31 and the body region 13. However, having a compensation region 31 with a lower width than the body region 13 is only an example. It is also possible to implement the compensation region 31 and the body region 13 with the same width, or to implement the compensation region 31 with a larger width than the body region 13. This also applies to the other embodiments explained with reference to FIGS. 10 and 11 below.

FIG. 10 illustrates a horizontal cross sectional view of a MOSFET with a rectangular, specifically with a square cell geometry. In this example, the body region 13 has a rectangular, specifically a square geometry. The compensation region 31 also has a rectangular, specifically a square geometry. The control electrode 41 also has a rectangular, specifically a square geometry.

FIG. 11 illustrates an embodiment, in which a transistor cell has a hexagonal geometry, the compensation region 31 has a hexagonal geometry, and the control electrode 41 has a hexagonal geometry. In this connection it should be noted that besides a hexagonal geometry any other polygonal geometry may be used as well.

Implementing the body region 13, the compensation region 31 and the control electrode 41 with same geometries is not mandatory. The geometry of the compensation region 31 could also be different from the geometry of the body region 13, and the geometry of the control electrode 41 could also be different from the geometry of the compensation region 31. For example, each of the following geometries can be used independently for each of the body region 13, the compensation region 31 and the control electrode 41: rectangular, square, hexagonal, polygonal, circular.

FIG. 12 illustrates a horizontal cross sectional view of a MOSFET in which the individual transistor cells have a rectangular geometry, i.e. the body regions 13 have a rectangular geometry, in which the compensation regions 31 also have a rectangular geometry. The control electrode 41 has a stripe geometry, so that one control electrode 41 is common to several transistor cells. Implementing the compensation region 31 with the same geometry as the body region 13 is only an example. It is also possible to implement the body region 13 and the compensation region 31 with different geometries.

FIG. 13 illustrates an embodiment in which the compensation region 31 has a stripe geometry and in which several control electrodes 41 each having a rectangular geometry are coupled to one compensation region 31. Instead of a rectangular geometry a circular, hexagonal or any other polygonal geometry may be used for the control electrode 41 as well.

The connection of the control electrode 41 to the control terminal G2 is only schematically illustrated in FIG. 8. The control terminal G2 may be implemented as an electrode that is arranged above the semiconductor body 100 and to which the control electrode 41 is connected to at a position which is not illustrated in the vertical cross sectional view illustrated in FIG. 8.

FIG. 14 schematically illustrates a perspective sectional view of a MOSFET with stripe transistor cells in order to illustrate one possible way of contacting the (buried) control electrode 41. In FIG. 14, only one transistor cell of the MOSFET is illustrated. This transistor cell has a stripe geometry, and the compensation region 31 and the control electrode 41 also have a stripe geometry. The control electrode 41 essentially extends parallel to the compensation region 31 and the body region 13 between the body region 13 and the compensation region 31. The control electrode 41, in this example, includes a connection electrode 44 which in the vertical direction of the semiconductor body extends through the body region 13, and the source region 12 to a contact electrode 45 (shown in FIG. 15) that is connected to the control terminal G2 or that forms the control terminal G2.

FIG. 15 illustrates a schematic vertical cross sectional view of the MOSFET of FIG. 14 in a section plane C-C that cuts through the region of the MOSFET in which the connection electrode 44 and the contact electrode 45 are arranged. As can be seen from FIG. 14, the control electrode 41 and the connection electrode 44 are dielectrically insulated from the body and source regions 13, 12 by the control electrode dielectric 42. The contact electrode 45 is arranged above the semiconductor body 100 and is electrically insulated from the gate electrode 21. An electrical insulation between the contact electrode 45 and the gate electrode 21 can be provided by the same insulation layer and/or dielectric layer 23 that is arranged between the gate electrode 21 and the source electrode 51. Optionally, the control electrode dielectric 42 is also arranged between the contact electrode 45 and the gate electrode 21.

The source electrode 51 is arranged distant to the contact electrode 45 in a lateral direction and is electrically insulated from the source electrode 51 by an insulation layer. Referring to FIG. 15, the source region 12 and the gate electrode 21 may also be arranged below the contact electrode 45. However, providing the source region 12 and the gate electrode 21 below the contact electrode 45 is optional. According to a further embodiment, the source region 12 and the gate electrode 21 do not extend to below the contact electrode 45. The control electrode 41, the connection electrode 44 and the contact electrode 45 can be formed from the same conducting material such as, e.g., a metal or a highly doped polycrystalline semiconductor material. However, it is also possible to implement these electrodes 41, 44, 45 with different electrode materials. In a manner not illustrated in detail, the contact electrode 45 may be connected to control electrodes 41 of a plurality of transistor cells each through a connection electrode 44.

In the embodiment illustrated in FIG. 14, the control electrode 41 has an elongated (stripe) geometry and extends along the compensation region 31 and the body region, so that the compensation region 31 can be electrically connected to the body region 13 along its complete longitudinal length. However, this is only one possible example.

Referring to FIG. 16 it is also possible to provide the control electrode 41 only at one position or to provide several control electrodes 41 at different positions along the compensation region 31. FIG. 16 illustrates a schematic perspective sectional view of a MOSFET in which the control electrode 41 does not completely extend along the compensation region 31, but is only arranged below the connection electrode 44.

According to one embodiment, the MOSFET includes both, transistor cells that are coupled to the body region 13 and the source electrode 51, respectively, via a coupling arrangement 40, and conventional transistor cells. A “conventional transistor cell” is a transistor cell that has its compensation region permanently connected to the body region 13. For illustration purposes only, a schematic perspective sectional view of a conventional transistor cell with a stripe geometry is illustrated in FIG. 17. Of course, any other cell geometry may be implemented as well. In the transistor cell of FIG. 18, a compensation region 31′ adjoins the body region 13 and is, therefore, electrically connected to the source electrode 51. In the conventional cell of FIG. 17, like reference characters denote like regions as in the transistor cells explained with reference to FIGS. 3 to 16.

In the following, conventional transistor cells are referred to as transistor cells of a first type, while transistor cells with a coupling arrangement 40 are referred to as transistor cells of a second type. The individual transistor cells may be implemented such that they include one common drift region and one common drain region.

Transistor cells of the first and second type can be arranged in the semiconductor body 100 in many different ways. According to a first embodiment that is illustrated in FIG. 19, the transistor cells of the first and second type are arranged alternately. FIG. 18 illustrates a horizontal cross sectional view in a section plane that corresponds to section plane B-B in FIG. 8 and that cuts through the compensation regions 31, 31′. In the embodiment of FIG. 19, the transistor cells and the compensation regions 31, 31′ have a stripe geometry. However, any other cell geometry and compensation region geometry may be used as well.

According to a further embodiment illustrated in FIG. 19, which also shows a horizontal cross sectional view of the semiconductor body, a group of several cells of the second type (having a compensation region 31) is arranged next to a group of several cells of the first type (having a compensation region 31′).

According to one embodiment, in a MOSFET that includes transistor cells of the first and second type, the transistor cells of the second type are implemented without a channel region, which means without a source region 12 and/or without a gate electrode 21.

A vertical cross sectional view of a transistor cell of the second type which does not include a source region is illustrated in FIG. 20. The gate electrode 21 (illustrated in dashed lines) is optional in this case. In a MOSFET with transistor cells of the first and second type, the transistor cells of the second type, which are those cells that have their compensation regions coupled to the source or body region through a coupling arrangement, only serve to adjust the output capacitance and the on-resistance when they are implemented without channel region. The current flowing through the drift region 11 when the MOSFET is in its on-state is only provided through the channel regions of the transistor cells of the first type. The “channel regions” of the conventional cells are the regions in the body region 12 from the source along the gate dielectric 22 of the conventional cells to the drift region 11(see FIG. 17).

The operating principle of a MOSFET with transistor cells of the first and second type will now be explained with reference to FIG. 21. FIG. 22 illustrates a circuit diagram representing the MOSFET 10. The circuit diagram includes a plurality of n first transistors 1 ₁₁, . . . , 11 n, each representing transistor cell of the first type or a group of transistor cells of the first type, and m second transistors 1 ₂₁, . . . , 1 _(2m), each representing a transistor cell of the second type or a group of transistor cells of the second type. The individual cells can be implemented in one of the ways explained before.

The individual transistor cells are connected in parallel. This is represented in FIG. 22 in that the drain source paths of the transistors 10 ₁₁, . . . , 10 _(1n), 10 ₂₁, . . . , 10 _(2m) are connected in parallel and that the transistors have their gate terminals coupled together to form the gate terminal G. The transistors that represent the transistor cells of the second type have a control terminal besides the gate terminal for adjusting the output capacitance and the on-resistance. In the embodiment illustrated in FIG. 22, the cells of the second type have their control terminals coupled together to form the control terminal G2 of the MOSFET.

The MOSFET can be operated with a first on-resistance and a first output capacitance, when the cells of the second type are operated such that the coupling arrangement is in the first operating state, so that the compensation regions of the cells of the second type are electrically connected to one the body region, the source region, and the source electrode. The MOSFET can also be operated with a second on-resistance that is higher than the first on-resistance and with a second output capacitance that is lower than the first output capacitance, when the cells of the second type are operated such that the coupling arrangement is in the second operating state, so that the compensation regions of the cells of the second type are floating. A ratio between the first and the second on-resistance and between the first and the second output capacitance is dependent on a ratio between the overall size of the active areas of the transistor cells of the first type and the overall size of the active areas of the transistor cells of the second type. Assume, for example, that the individual cells have identical sizes. In this case, the overall size of the active areas of the cells of the first type and of the cells of the second type is proportional to the number of cells of the first and second type, respectively. According to one embodiment, the size ratio A_(CON)/A_(CA) between the overall size of the active areas of the cells of the first type and the overall size of the active areas of the cells of the second type is between 10:1 and 1:10, in particular between 2:1 and 1:2, or even 1.5:1 and 1:1.5.

Referring to a further embodiment, illustrated in FIG. 22, the MOSFT includes a plurality of p, with p≧2 of control terminals G2 ₁, G2 _(p). Each of these control terminals G2 ₁, G2 _(p) serves to control the operating state of a coupling arrangement 40 of a group of cells of the second type, where each of these groups includes at least one cell of the second type.

In the MOSFT of FIG. 23, the on-resistance and the output capacitance may each be adjusted to p+1 different values by varying the number of the groups of cells of the second type that are operated in the first or second operating state.

In the embodiments explained before, the coupling arrangement 40 acts like a switch that, dependent on a drive signal applied to the control terminal, electrically connects the compensation region 31 to one of the body region 13, source 12, and source electrode 51 or leaves the compensation region 31 floating.

According to a further embodiment illustrated in FIG. 23, the coupling arrangement also controls a current that may flow between the compensation region 31 and one of the body region 13, source 12, and source electrode 51. For this, the coupling arrangement 40 may be implemented like a variable resistor having a resistance controlled by a drive signal applied to the control terminal G2. When the resistance of this variable resistor is controlled to be very high, the compensation region 31 is not discharged or is only very slowly discharged when the MOSFET switches on, while the compensation region 31 is rapidly discharged when the resistance is low. The variable resistor may be implemented with a control electrode 41 and dielectric 42 as shown in FIG. 8, wherein the resistance between the compensation region 31 and the body region 13 or source electrode can be adjusted by suitable selecting the drive potential applied to the control electrode 41.

The output capacitance C_(OSS) of the MOSFET not only influence switching losses of the MOSFET, but also influences the dynamic behavior of the MOSFET, such as the slope of rising and falling edges of load current through the MOSFET and of the drain-source voltage, when the MOSFET is switched on and off, where a low output capacitance C_(OSS) may result in steep slopes. Adjusting the maximum discharging current that may flow from the compensation region 31 to a low value may result in a low output capacitance at the of time switching, and may therefore result in steep switching slopes. The compensation region 31 is nevertheless discharged after a while, resulting in a low on-resistance after a delay time after the time of switching.

The coupling arrangement 40 could also be implemented with circuit elements that are capable of controlling or limiting the current between the compensation region 31 and one of the source electrode 51, the body region 13, the source region 12, and the gate electrode 21 dependent on a drive signal applied to the control terminal G2. In particular, the coupling arrangement 40 can be configured to limit the current to or from the compensation region 31 to a maximum value that is dependent on the control signal at the control terminal. Conventional controllable current limiters may be used in this connection.

Referring to what has been explained before, there is a tradeoff between ohmic losses and capacitive losses, wherein this tradeoff is dependent on the load condition of the transistor. The load condition is, for example, defined by the load current flowing through the transistor in its on-state and/or by a switching frequency at which the transistor is operated. When, for example, the load current is high, it is desirable to reduce the on-resistance in order to decrease the ohmic losses, even if this results in a small increase of the total switching losses. Although the capacitive losses are independent of the current the switching losses in transition phases during turn-on and/or during turn-off increase at high load currents. The ohmic losses mainly govern the overall losses at high load currents because they increase with the square of the load current. According to one embodiment the MOSFET is, therefore operated such that with increasing load current the on resistance is reduced, while with increasing switching frequency the output capacitance is reduced.

The on-resistance can be reduced by driving the transistor cells of the second type such that the number of cells that are operated in the first operating state is increased.

The output capacitance can be reduced by driving the transistor cells of the second type such that the number of cells that are operated in the second operating state is increased.

Although various exemplary embodiments of the invention have been disclosed, it will be apparent to those skilled in the art that various changes and modifications can be made which will achieve some of the advantages of the invention without departing from the spirit and scope of the invention. It will be obvious to those reasonably skilled in the art that other components performing the same functions may be suitably substituted. It should be mentioned that features explained with reference to a specific figure may be combined with features of other figures, even in those cases in which this has not explicitly been mentioned. Further, the methods of the invention may be achieved in either all software implementations, using the appropriate processor instructions, or in hybrid implementations that utilize a combination of hardware logic and software logic to achieve the same results. Such modifications to the inventive concept are intended to be covered by the appended claims.

Spatially relative terms such as “under”, “below”, “lower”, “over”, “upper” and the like, are used for ease of description to explain the positioning of one element relative to a second element. These terms are intended to encompass different orientations of the device in addition to different orientations than those depicted in the figures. Further, terms such as “first”, “second”, and the like, are also used to describe various elements, regions, sections, etc. and are also not intended to be limiting. Like terms refer to like elements throughout the description.

As used herein, the terms “having”, “containing”, “including”, “comprising” and the like are open ended terms that indicate the presence of stated elements or features, but do not preclude additional elements or features. The articles “a”, “an” and “the” are intended to include the plural as well as the singular, unless the context clearly indicates otherwise.

It is to be understood that the features of the various embodiments described herein may be combined with each other, unless specifically noted otherwise.

Although specific embodiments have been illustrated and described herein, it will be appreciated by those of ordinary skill in the art that a variety of alternate and/or equivalent implementations may be substituted for the specific embodiments shown and described without departing from the scope of the present invention. This application is intended to cover any adaptations or variations of the specific embodiments discussed herein. Therefore, it is intended that this invention be limited only by the claims and the equivalents thereof. 

What is claimed is:
 1. A MOSFET comprising at least one transistor cell, the at least one transistor cell comprising: a source region, a drain region, a body region and a drift region, the body region arranged between the source region and the drift region and the drift region arranged between the body region and the drain region; a compensation region arranged in the drift region and distant to the body region; a source electrode electrically contacting the source region and the body region; a gate electrode arranged adjacent the body region and dielectrically insulated from the body region by a gate dielectric; and an electronic switch comprising a control terminal and being configured to electrically couple the compensation region to at least one of the body region, the source region and the source electrode dependent on a control signal received at the control terminal.
 2. The MOSFET of claim 1, wherein the electronic switch is configured to adjust or control a current between the compensation region and at least one of the body region, the source region and the source electrode.
 3. The MOSFET of claim 1, wherein the coupling arrangement further comprises a variable resistor.
 4. The MOSFET of claim 1, wherein the electronic switch is configured to limit a current between the compensation region and the at least one of the body region, the source region and the source electrode based on the control signal.
 5. The MOSFET of claim 1, further comprising a plurality of transistor cells having a common drift region, a common drain region and gate electrodes connected to a common gate terminal.
 6. The MOSFET of claim 5, wherein the electronic switch of the plurality of transistor cells have their control terminals connected to a common control terminal.
 7. The MOSFET of claim 5, wherein the plurality of transistor cells is subdivided into p, with p≧2, groups of transistor cells, each group of transistor cells having a group control terminal and the transistor cells of each group having their control terminals connected to a corresponding group control terminal. 